Smart AOI System for Advanced Packaging Substrates

Challenges

Many factories still use manual inspection to check things like via holes and trace widths on substrates.
But with more complex designs especially double-layer packaging manual checks are too slow,   inconsistent, and not reliable for high-volume production.

 

  • Challenges in Advanced Packaging requires High-precision features (e.g., 20–30 µm via holes).
  • Consistent inspection Manual scope checking is labor-intensive.
  • Prone to variability Data traceability was limited due to handwritten records.
  • Cycle time was too long to support increasing throughput demands.

Our Solution

Smart AOI system is built to meet the needs of advanced packaging, where accuracy, consistency,and  traceability are very important.

Key Benefits:

  • Repeatability improved, meeting tight packaging tolerance
  • Reduce cycle time by 60% enabling faster line throughput
  • Reduced manpower requirement for inspection by over 50%
  • Inspection data automatically logged and exported to MES
  • Manual errors eliminated, boosting yield stability.